Electronic Packaging

Southern Research offers electronic packaging product and process development support for a range of applications, including medical, automotive, and military. Microelectronic packages often operate in extremely harsh environments and require extended service lives. Characterizing the failure mechanisms and predicting product life in such environments are critical to the long-term reliability of these devices.

Southern Research provides electronic packaging reliability and manufacturability testing as well as failure analysis to assist with the development of robust and cost-effective microelectronic assemblies. Specifically, we support electronic packaging product and process development in the following areas: testing of electronic packages and assemblies; characterization of warpage during reflow; and quality and reliability testing. Southern Research utilizes a wide array of test methods to characterize the thermal, mechanical, and moisture behaviors of electronic components and their constituent materials.

• Testing
• Moisture conditioning
• Temperature/humidity cycling
• Vibration testing
• Cyclic corrosion testing
• Radiographic inspection
• Monotonic, cyclic, and creep testing
• Thermal expansion (PTE), thermal conductivity, and warpage
• DSC, DMA, and TGA
• Reflow simulator to evaluate reflow and warpage
• Failure analysis
• Material/interfacial adhesion characterization
• Product life expectancy studies
• BGA, CSP, and underfill evaluation
• Scanning electron microscopy (SEM)
• Surface chemistry composition analysis
• 3-D laser profilometry
• Finite element analysis